Soliton provides test engineering development services for semiconductor manufacturing test on the NI STS system with experience in optimizing the programs for optimum throughput in multi-site testing. For example, experimentation has shown that for analyzing a Batch of approximately 200 devices using a temperature chamber, a testing period of approximately 20 hours is required whereas by using the above-described method the same tests can be carried out inside, in the very least, 3 hours. After the significant thermal equilibrium was reached, the electrical features tests are conducted on the device 10 at the test temperature.
This feature is helpful for measuring the voltage peaks across the commutator capacitor for the power SCRs in an electric vehicle, for example. Three-terminal devices such as transistors and FETs additionally use a link to the management terminal of the device being tested such as the Base or Gate terminal. The memory module 15 is inserted directly into a socket 153 mounted on a mother board 151.
The whole period of the liquid flow may be controlled either manually or automatically by a controller means 52 like a solenoid valve, inserted in the fluid flow line 48 between the liquid source 46 and the nozzle 50. However, since the length of the fluid flow is rather brief, it is preferred that the controller means 52 be linked via a control line 54 to a timing device (not shown).
For transistors and other current based devices, the base or alternative control terminal current is stepped. EPTC intends to offer a good coverage of technological improvements in allareas of electronic packaging from design to manufacturing and operation. Device for heating and controlling temperature within an integrated circuit chip.
When analyzing memory devices including SDRAM (Synchronous Dynamic Random Access Memory), Rambus DRAM or SRAM (Static Random Access Memory), the packaged device is inserted into a test socket which interfaces the device to test equipment that checks the electrical and functional characteristics in addition to the dependability of the gadget.
The device is coupled to the back side of the circuit board through evaluation terminals formed on the rear side of the board. Wherein coupling the semiconductor device to the interface board includes coupling a module having the semiconductor apparatus mounted thereon into a socket on the interface board. Discrete SMUs offer you a broader range of current, voltage, and power levels than mainframe-based systems permit and allow the system to be reconfigured as evaluation needs change.
In the method embodying the principles of the present invention, a typical semiconductor device, indicated generally at 10 in the drawing, is placed in An evaluation socket 12. Although this discussion is led to the testing of a particular semiconductor device it will be recognized that any semiconductor device having at least one PN junction therein may be tested via this method.See more at Mspecllc.com